Semiconductor Manufacturing
Semiconductor manufacturing, from wafer fabrication to advanced packaging, is costly, complex, and fixed to extended timelines. After investing heavily in upstream production processes, finish strong to protect your investment and reputation.
Reduce stress on solder joints, improve mechanical support and stability, and protect chips from shock, moisture, and temperature changes with innovative precision dispensing and plasma treatment solutions for 2, 2.5, and 3D heterogeneous integration and chiplet architectures.
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Stay up-to-date on the latest dispensing, plasma treatment, conformal coating, and selective soldering news, including modern application techniques, tips, and industry insights.